Wafer and Die Inspection
Imaging through semiconductor wafers and integrated circuit chips for defect inspection is easy and straightforward when using a IR camera because these materials (Si and Gallium Arsenide (GaAs)) are transparent in the infrared wavelength range. This ability to see through Si, the most commonly used semiconductor material by far, provides a non-destructive inspection method greatly improving the production process.
During the wafer manufacturing process, particles or cracks can exist inside or between wafers. Whereas visible CCD or CMOS cameras can be used to detect defects on top of a wafer, SWIR cameras have the capability to see “inside” Si and can detect particles, voids or other imperfections between two bonded wafers.
Wafer Inner Crack Inspection Machine
Wafer Loading System
Wafer Loading System for Loadport, Robot and Prealigner
Optical System Principle
- Can measure Inner crack, Pinhole, Air-pocket.
- Can measure Top, internal, Bottom defects.
- Resolution depends on requirements, pixel size, WPH, methodology.
- Have optional detectors of 3.5um/pixel & 2.5um/pixel.
Deep Learning Intelligence Inspection
- Support small size sample training
- High efficiency of data analysis
- Accuracy > 95%
Sample:
